Chemcut - Wet Processing Line Etcher

Chemcut Corporation – the world’s pioneer and leader in horizontal wet processing equipment for over 60 years has delivered over 18,000 machines to more than 1,600 customers worldwide.  Customers include PCB & FPC, PCM, Solar, Touch Panel and LCD displayer companies in the world.

Chemcut has been serving for the semiconductor industry in the areas:

●   Water processing: CU, Titanium/Tungsten (Ti/W) and other Metals Etching, Dry Film Developing and Stripping.
●   Back etching for lead frames (QFN), BGAs and etc.
●   Lead frames and IC Substrates processing


　

Alkaline Etching:

•Etch Rate: 25-40um/min, suitable for thick Copper (above 15um) etching process
•Low undercut
•No damage on Metal (Nickel/Gold) Plating

Acidic Etching:

•Etch Rate: 5-10um/min, suitable for thin Copper (under 15um) etching process
•High undercut
•May damage on Metal(Nickel/Gold) plating
　

Small Production Lot and Prototype Systems

The Chemcut 2300 series is a family of compact, double sided, horizontal, conveyorized, oscillating-spray processing systems built with the same proven techniques and quality used on Chemcut’s larger systems. The 2300 series is ideally suited for laboratory, prototype and small production lots of printed circuits as well as chemically machined parts, instrument panels and nameplates.

This series of wet process equipment is available in several configurations designed for copper and ferric chloride etching, alkaline-ammonical etching, resist developing, chemical cleaning and resist stripping.  Special versions of the machines are available for specialty processing, such as etching with hydrofluoric and nitric acid mixtures and high temperature etching (up to 160°F, 71°C).

Versions Available For：
•Chemical Cleaning

•Ferric Etching

•Cupric Etching

•Alkaline Etching

•Resist Developing

•Resist Stripping

•15 and 20 Inch Widths

•18 x 24 Capable

Excellent Choice For：
•Prototype Shops

•Small Lot Shops

•Development Labs

•R&D Departments

•Universities

•Specialty Processing

•Alternative Chemistries

•Milling Special Alloys

•Waste Reduction

CC8800 is designed for processing Semiconductor, IC (Lead Frames & IC Substrates), high end HDI PCB / FPC, Touch Panel and LCD Displayers, Solar and Precision Metal Parts.  Its unique spray rack designs enable it to reach a higher level of etch quantities.  Over 700 systems were built and installed since it was launched.

Wet Pattern (Pad) Making:

•Dry Film Developing
•Copper Etching
•Titanium/Tungsten

Water Wet Bumping Processes:

•Photo Resist Developing: Similar to Pad making
•Photo Resist Stripping: Require high spray pressure (30-40 bars), and specialty stripping chemicals
•Seed Layer (UBM) Etching: Use spray or immersion processes, and different chemicals for various metals