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Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.

PVA TePla America - Plasma Processing System

PVA TePla America
Plasma Processing System

 

Plasma Cleaning is a dry, solvent free technology used to precision clean substrates at the molecular level. Precision cleaning is a requirement for a broad spectrum of industries with applications ranging from semiconductor wafer cleaning in micro-electronics to  bio-burden decontamination of medical devices. Achieving and maintaining surface cleanliness at the molecular level during manufacturing unique methodologies.

Gas plasma cleaning removes surface contamination at the molecular level following machining, tooling and wet chemical processing steps. Plasma precision cleaning is a conformal process, not only for substrates of complex geometries but also on textured surfaces with “rough” topographies.

Since plasma cleaning is a dry process there are none of the liabilities associated with wet chemistry, such as exposure, chemical storage and waste disposal, health and safety restrictions on the use of dangerous solvents, solvent absorption into product, etc. This is the reason that plasma cleaning has earned itself the status “The green alternative to solvent cleaning”.

 


 

NEW!
INLINE HIGH CAPACITY PECVD
The ILHC is a continuous high speed vacuum plasma system. It offers full process control for plasma assisted chemical vapor deposition (PECVD), etching, cleaning and activation in a high production environment.

Gas plasma is the technology of choice for surface modification of materials in the life sciences, consumer electronic electronics, semiconductors and a variety of industrial components. This new and unique system design has moved plasma technology field to new level of performance and capability.

The ILHC was designed to meet high production flow requirements of our customers. It provides fast process treatment times, excellent uniformity and precise thickness control. Its features provide state of the art process control, fail-safe systems with alarms and full data capturing and reporting software.

The ILHC uses radio frequency (RF) generated plasma combined with a unique conveyor system in a well laid out and fully integrated package. The design allows for easy installation and maintenance in production environments.
Feature::

• Continuous flow processing
• Customized trays and substrate fixtures
• Configurable plasma source design scalable for small to large
• 3-dimensional parts or ultra high volume small part processing
• Flexible RF Power Generator & AMU based on process requirements
• Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101
• User access control for independent process development
• Process tolerance controls allowing precise lot-to-lot repeatability
• Remote statistical process control monitoring via Ethernet
• Onboard diagnostic features and alarm logging
• Recipe editor offers fast and versatile step control functionality
• Large (LCD) touch panel and keyboard provided with Windows® based control
• Robotic interface allows complete hands free operation
 



A variety of devices
can be processed

 thoughput up to
500,000 devices a month *
 (typical for 1” x 1” devices)

 Non uniformity less then 5% *
(dependent on device geometry)

 


 

RF Plasma Systems

 

IoN 3B 
System Features:

Aluminum Chamber diamensions (W x D x H): 140mm x 200mm x 110mm
Variable power: 100 Watts
Gas Shower Head Integrated door
Single gas channel Mass Flow Controller for gas control, 50 sccm
View Port: 45mm dia.
Monitor: 7" touch screen, PC Interface
Operating mode: Up to 10 recipes with 10 steps can be stored
Pressure Measurement: Pirani Gauge


 

IoN 7B 
System Features:

Aluminum Chamber diamensions (W x D x H): 200mm x 220mm x 160mm
Variable power: 200 Watts
Gas Shower Head Integrated door
Single gas channel Mass Flow Controller for gas control, 100 sccm
View Port: 45mm dia.
Monitor: 7" touch screen, PC Interface
Operating mode: Upto 10 receipies with 10 steps can
Pressure Measurement: Pirani Gauge