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Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.

AML - Wafer Bonders

      Applied Microengineering Limited
AML In-situ Aligned Wafer Bonders

AML ("Applied Microengineering Ltd" ) was founded in 1992. AML manufactures unique in-situ aligned wafer bonding machines and provides services based around wafer bonding in its new state-of-the-art multi-million pound £ BONDCENTRE facility situated on UK's premiere science park in Harwell, Oxfordshire.

AML's unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. A new upgrades is also now available to allow polymer embossing, imprinting, NIL and other pattern transfer techniques. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lower cost of ownership and first class support. AML Bondcenter provides customers with production bonded substrates, device fabrication and 3D integration and wafer package best place.

 
  Wafer bonding capability
 
  • Anodic bonding, Si-Glass
  • Eutectic Bonding
  • Adhesive Bonding
    (UV Curing)
  • Direct bonding (High & Low Temp.), Si-Si
  • Glass Frit Bonding
  • Thermo Compression Bonding
 

 

       In Situ Plasma
   Activation Treatment

InSitu Aligned Systems

 

                 

 

       
  AML Wafer Bonders  
    Features:
• Activation, align and bond in single system
• Independent heated upper and lower platen, suitable for
  Getter material
• Low cost of ownership & high productiviting
• Full automation control & data acquisition
• Up to 1 micron accuracy, manual and auto alignment
• Wafer size: 2" to 12"
• Bonding process in vacuum with self contain dry pumping
  system
• VIS, IR and NIR optics for backside alignment

   
   

AWB 04, 08 & Brute    

 

   
         
 

 

FAB12 - Aligned Wafer Bonders  
 

Model                   
Wafer size           
Wafer Thickness 
Wafer Transmission 
Air pressure         
Pumpdown Time    
Max Bonding Force
Case Amount         
                                   

: FAB12
: 150 & 200mm (or 300mm)
: Max. stack height 6.5mm
: Contact edge 3mm area
: 10-6mbar range
: 5 min (to 10-5mbar)
: 25kN
: 2 or 3 (FOUP, SMIF or
  Open Cassette Load Ports)

 
 

               FAB12