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Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.

Acid Decap & Delayering Systems

Automated Acid Decapsulation Systems

Nisene Technology Group — formerly B&G International — has been the world leader in decapsulator technology since its introduction into the semiconductor industry over 30 years ago. Nisene Technology Group offers a comprehensive range of products, methodologies and support services that encompass all IC decapsulation requirements.

Nisene Awarded Three Patents ! 

Nisene Technology Group has been awarded THREE unique patents on THREE different products/processes for our industry-leading decapsulation equipment. 

  • CuProtect Process - U.S. Patent 8,945,343 B2 - Decapsulation with an applied voltage. 
  • TotalProtect Process - U.S. Patent 9,543,173 B2 - Decapsulation with an applied voltage and cooling system. 
  • PlasmaEtch Process - U.S. Patent 9,548,227 B2 - Microwave - induced plasma using plasma discharge tube. 

 

JetEtch Pro Decapsulation Systems

Nisene Technology Group is committed to providing innovative, high-quality products which address the changing needs of failure analysis professionals. Nisene is to continue to provide products and services that address the needs of our customer, and to offer fast, precise, reproducible and safe package decapsulations - a goal that can only be met with automated instrumentation.

 

Latest JetEtch Pro System uses acid corrosion of molding compound to expose die in any kind of IC packages. Acid Decapsulation process is quick, safe, and it produces clean, no corrosion to the die surface.The whole acid decapsulation process is performed under a pressurized chamber that is filled with inert gas. It not only can reduce the chance of oxidation of IC package metal surface, but also reduces the volume of corrosive gases generated. The system is designed to be operated with the minimal training due to its ease of use. Some major advantages are listed below:

 

  • Flexible Etch Time: 1 - 1800 seconds (adjustable in one-second increments)
  • One-hundred (100) Etch Recipe Storage
  • Wide Temperature Range: 20°C - 250°C
  • Thirteen (13) Mixed-acid Ratios
  • Wide Range of Etchant Acid Volumes: 1 mL/min - 10 mL/min
  • Wide range of user selectable acid mix ratios
  • Ability to perform multi-step decapsulation processes
  • Pulse etching enabling rapid decapping with minimal acid consumption
  • Optimization of acid carrying capacity to maximize vortex etching
  • Pulse acid etching
  • Lifetime etch head warranty
  • Pneumo-electric pumping with bi-directional capabilities
  • Smart waste acid diverting valve to eliminate potential hazardous waste acids problems
  • Safety awareness in design, including ease of bottle exchange
  • Software compiled in C
  • CE certification and SEMI S-2 compliance

 

   

CuPROTECT -
a proprietary and patent - pending Process

 

JetEtch TotalPROTECT Advanced Decapsulation Systems

With an unequaled feature set, the TotalProtect can etch the widest variety of any integrated circuits of any system on the market while maintaining the integrity of sensitive internal components.



The TotalProtect system comes equipped with all of the great features of the JetEtch Pro decapsulation system, as you might expect. It also comes with the patented bias voltage application process capability of the CuProtect. In addition to that, it ALSO has a special cooling feature that allows sub-ambient cooling of the etching acid. When combined with the bias application process, the TotalProtect offers the end user a tremendous range of etching parameters for virtually endless recipe combinations. It's the total package for total protection. It's the JetEtch Pro TotalProtect.

     
     
Examples of TotalProtect Decaps
at High Magnification (SEM)

 

PlasmaEtch Plasma Decapsulation Systems

The PlasmaEtch decapsulation system is a revolutionary patent-pending gas-based semiconductor etching system. Employing a never-before-seen application of microwaved gases inciting chemical radicals for isotropic etching, the PlasmaEtch is the greenest and most cost-effective etching solution available. The PlasmaEtch can etch most sample sizes, encapsulant types, and wire bond types. Whether it's a more traditional gold wire sample, or if the sample features copper or silver wires, the PlasmaEtch delivers a safe and reliable etch.

 
  • Highly Customizable Etch Recipes
  • Etches a Wide Variety of Package Types
  • Completely Chemical-free Decap
  • Eco-friendly
  • Touchscreen Interface
  • PC/Windows-based GUI
  • The Only Solution for Silver Wires
  • Etches Samples with All Wire Types
  • Small Footprint Suited for Tabletop

 

 

Accessory Kits

Nisene Technology Group offers a wide range of standard Accessory Kits, typically consisting of gaskets and Alignment Plates, that meet the requirements for accurate and reproducible decapsulation of most common plates IC package.

 

- Basic Kit
- DIP/SIP Kit
- PLCC Kit
- SOIC Kit
- QFP Kit
- PBGA Kit
- QFN/MLP Kit
- Die Down BGA Kit
- Universal Accessory Kit


Gaskets and Alignment Plates


Customized Gaskets for
Unique Requirements