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Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.

MicroChem / Nippon Kayaku - Photoresists


MicroChem Corp. (MCC) develops, manufactures, sells, and supports specialty niche chemicals for semiconductor/IC, thin film head, and other electronic manufacturing applications. The primary focus is photosensitive materials, such as photoresists, and other ancillary products. MCC technology consists of proprietary and non-proprietary products requiring state-of-the-art technical expertise, high reproducibility, high product cleanliness, and specialty microfiltration.

 

MicroChem manufactures all of their products in their newly re-fitted 25,000 square foot facility in Newton, Massachusetts. All the products are made in environmentally controlled areas and packaged in Class 100 Cleanroom environments.

 

Microchem resist products are available in 500ml, 1 Liter, 4 Liter Amber glass bottles, in addition we can package into 10 and 20 Liter Nowpaks. The ancillary products are available in 4 Liter Polyethylene bottles, Nowpaks and 55 Gallon drums.

 

 

 

 

Product index: Application Note (pdf)

 

 

 

 

 

 

SU-8 2000 & 3000 Series Resists

 

The SU-8 product line consists of chemically amplified; epoxy based negative resists with high functionality, high optical transparency and are sensitive to near UV radiation. Cured films or topography are highly resistant to solvents, acids and bases and have excellent thermal stability, making it well suited for permanent use applications.

 

SU-8 2000 Permanent Epoxy Resists

SU-8 2000 chemically amplified, i-line resists are well-suited for the fabrication of permanent device structures. These negative tone, epoxy based resists exhibit excellent chemical resistance and low Young's Modulus which makes them ideal for fabricating micro/nano structures such as cantilevers, membranes, and microchannels.

 

Material uses:
  • Fabrication of PDMS molds
  • Structural components such as micro arrays, fluidic channels, display pixel walls and dielectric layers
  • Dry etch masks
  • Rapid prototyping
Material attributes:
  • Spin coat films from 75µm
  • High thermal and chemical resistance
  • Optically transparent
  • Compatible with i-line imaging equipment

 

 

 

Learn More

25 µm wide, 125 µm high
Source: MicroChem
10µm features, 50µm SU-8 2000 coating
Source: Micro Resist Technology

Cantilever

Genoletet, al., IBM-Zurich, Rev. Sci.
Instrum., 70, 2398 (1999)

Microfluidic Actuator

N Chronis, LP Lee, UC Berkeley, μTAS 2002, 754 (20

Passivation layer for diodes.

Encapsulation with imaged vias.

                  LED Passivation Application

 

SU-8 3000

SU-8 3000 has been formulated for improved adhesion and reduced coating stress. It is being used where high bond strength and improved flexibility for microstructure fabrication is desired. As a result, adhesion to the substrate is greatly improved.
Material uses:
  • Waveguides

  • Microfluidics

  • Stamps

Material attributes:

  • Improved adhesion
  • Reduced coating stress
  • Vertical sidewalls
  • Greater than 100 μm film thickness in a single coat
  • Excellent dry etch resistance

10µm features in 50µm SU-8 3000 (contact expose)
Source: MicroChem

 

 

 

Learn More

 

KMPR 1000 Photoresist

KMPR® 1000 i-line photoresist is a high contrast, epoxy based photoresist that can be developed in a conventional aqueous alkaline developer (TMAH) and readily stripped from the substrate. KMPR is designed to coat 4-120 µm in a single step using four standard viscosities.

KMPR can be easily removed after completion of electroforming using commercially available chemical removers. Lithography can be used to form KMPR molds that have the required dimensional accuracy and sidewall verticality for micro electroforming.

Deep reactive ion etching (DRIE) compatible with the CMOS process, KMPR will survive dry etch for the extended periods of time necessary to perform >20 µm deep etching with HAR.

Material uses:

  • MEMS
  • DRIE
  • Electroplating
  • Permanent Structures

Material attributes:

  • High aspect ratio with vertical sidewalls
  • High chemical and plasma resistance
  • Greater than 100 µm film thickness in a single coat
  • Excellent adhesion to metals
  • Wet strips in conventional strippers
  • Excellent dry etch resistance
Plating Permanent Deep Etch

Plating (100 µM tall Ni posts, KMPR removed)

Electroformed Ni gear after stripping KMPR
Source: Univ. of Birmingham

Learn More

 

PMGI & LOR Under Layer Resists

PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from data storage and wireless ICs, to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach. This includes very high resolution metallization (4µm) metallization. These unique materials are available in a variety of formularies to meet virtually any customer need.

Material uses:

  • Metal lift-off processing

  • Airbridge fabrication

  • Release layers

Material attributes:

  • Won’t intermix when over-coated with imaging resists

  • Single step development of bi-layer stack in TMAH, or KOH developers

  • High thermal stability: TG ~190 C

  • Removes quickly and cleanly in conventional resist strippers

  • Enables sub .250µm micron bi-layer resist imaging

  • Enables high yield, very thick (>3µm) metal lift-off processing

 

LOR Bi-layer Lift-off Resists

  • High aspect ratio with vertical sidewallsresolution, for feature size <0.25µm metallization lift-off
  • Undercut controllable
  • Good  adhesion on Si, NiFe, GaAs, InP and III-V compounds etc.
  • High thermal stability
  • Remove easily and high lift off yield                                                         

 

Bi-Layer Lift-Off Process                                                       Lift-Off: An enabling, additive lithographic process.

 

 

GaAs Modulator with Al airbridge
Source: Nortel

PMGI used as a sacrificial layer on which the airbridge was built. The PMGI layer was subsequently removed with conventional resist removal processing.

 

Learn More

 

 

 

 

 

 

PMMA Resist

 

PMMA positive resists are based on special grades of polymethyl methacrylate designed to provide high contrast, high resolution for e-beam, deep UV (220-250nm) and X-ray lithographic processes. In addition, PMMA is often used as a protective layer in III-V device wafer thinning applications. Standard products include 495,000 and 950,000 molecular weights (MW) in a wide range of film thicknesses formulated in chlorobenzene, or the safer solvent anisole. In addition 50,000, 100,000, 200,000 and 2.2 million MW are available upon request.

Copolymer resists are based on a mixture of PMMA and ~8.5% methacrylic acid. Copolymer MMA (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off resist processes where independent control of CD size and shape of each resist layer is required. Standard copolymer resists are formulated in the safer solvent ethyl lactate and are available in a wide range of film thicknesses. In addition, MMA (17.5) MAA copolymer resists are available upon request.


Applications for PMMA & copolymer resists (MMA (8.5)MAA)

T-gate resulting from PMMA/Copolymer bilayer resist stack.

 

Product Attributes

  •  Feature size : less than 0.1µm imaging
  • E-beam, Deep UV and X-ray exposure
  • Molecular Weights (MW) : 495K, 950K, custom MW available

  • Solids content 2% - 11%, customized available
  • Molecular Solvent : Chlorobenzene (C) or Anisole (A)
  • Applications : E-beam usage, wafers, thinning, T-gate,  etc.


 

APPLICATIONS

Top Layer Construction Combined Layer Construction

 

 

 

 

LightLink Optical Waveguide Materials
Licensed from the Dow Chemical Company.

 

The LightLink product line consists of materials designed and developed for the fabrication of planar polymeric optical interconnects on rigid and flexible substrates. These siloxane-based materials exhibit high optical clarity and excellent resistance to heat and humidity, making them well suited for optical waveguide applications. These materials may also be applicable to other potential applications where superior optical properties and high environmental stability are required.

 

Product Uses:

  • Multimode waveguides (830-860nm)

  • Single-mode waveguides (1300-1500nm, short paths)

  • Board-level optical interconnects

 

 

Material Attributes:

  • Processable using conventional manufacturing equipment and methods

  • Photo-definable to 10痠 at 1:1 aspect ratio using aqueous developer

  • High transparency in the visible and near infrared

  • Low optical loss of 0.05 dB/cm at 850 nm

  • Low birefringence of <0.0001 at 850 nm

  • Excellent reliability in extreme temperature and high humidity environments

  • High mechanical robustness

Waveguide fabrication process overview


Step 1. Coat and cure LIGHTLINK Clad


Step 2. Coat and softbake LIGHTLINK Core
 



Step 3. Expose, post-exposure bake
and develop LIGHTLINK Core


Step 4. Coat and cure LIGHTLINK Clad

 


Core structure on Silicon  spin-coating, softbake

and mask lithography.
Source: MicroChem



Waveguide structure on FR4 PCB spin-coating,

softbake and mask lithography.
Source: MicroChem

 

gL2000 E-beam Positive Resists

gL2000 resists from Gluon Labs are high speed, high resolution e-beam resists which offer dry etch resistance equivalent to novolac based resists. Available in three dilutions that cover a range of thickness from 200 - 1000+ nm, the resists are available in 100 ml and quart sizes. Standard and high resolution developer formulations are available in 4 liter bottles along with a specialized remover.

 

Material Attributes

  • High speed, high resolution resist

  • Tunable develop process

  • High dry etch resistance (Superior to PMMA)

 

gL2000 Resolution

Film thickness: 60nm 100kV 10pA
Developer: gL Developer @ RT 30sec.



Pitch50nm/space16.25nm

 

Patterns

Film thickness: 230nm   100kV   50pA
Developer: gL Developer @RT 120sec



Dot Pattern



Pitch40nm/space12.5nm


 

 

Donut Pattern

 

PriElex® Jettable Polymeric Materials

PriElex® is envisioned as a new suite of functional inks for inkjet printing of electronic devices. PriElex® polymeric inks are designed and optimized for jetting and are suitable for maskless lithography, rapid prototyping, and clean, non-contact printing. Material formulations are tailored for critical inkjet properties such as viscosity, evaporation rate, and surface tension, and exhibit improved latency, firing stability, and resolution over standard resist formulations.

MicroChem currently offers XP PriElex® SU-8 1.0, an inkjettable SU-8 ink, adding to the developer's toolbox of printable materials available for the fabrication of single or multi-layer structures. Ink development was performed around the FUJIFILM Dimatix DMP printer, one of the most common R&D and prototyping inkjet tools.

Other PriElex® functional inks are envisioned, with some currently under development.

 


PriElex® SU-8 Material Uses:
  • Permanent 3D structures without photolithography
  • Coating over topography and irregular substrates
  • Dielectric and isolation patterning
  • Etch masking and other applications
  PriElex® SU-8 Material Attributes:
  • Low temperature cure (<150° C)
  • Optically transparent
  • Excellent thermal stability
  • High chemical resistance
  • Low Young's Modulus
  • Reduced material waste


Continuous Printed Patterns

PriElex® SU-8 Direct Write: 5 passes, linear scan
Source: MicroChem Corp

 

 
Additive Via Fabrication

Via pattern created with additive inkjet process
Source: MicroChem Corp