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Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.

AML - Wafer Bonders

Applied Microengineering Ltd (AML), UK

In-situ Aligned Wafer Bonders
AML (Applied Microengineering Ltd ) was founded in 1992, AML manufactures unique in-situ aligned wafer bonding machines and provides services based around wafer bonding in its new state-of-the-art multi-million pound £ BONDCENTRE facility situated on UK's premiere science park in Harwell, Oxfordshire.

AML's unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. A new upgrade is also now available to allow polymer embossing, imprinting, NIL and other pattern transfer techniques. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support. AML Bondcenter provides customers with production bonded substrates, device fabrication and 3D integration and wafer package best place.

 

AML Wafer Bonders

Features:

• Activation, align and bond in single system
• Independent heated upper and lower platen, suitable for Getter
   material
• Low cost of ownership & high productiviting
• Full automation control & data acquistion
• Up to 1 micron accuracy, manual and auto alignment
• Wafer size: 2" to 12"
• Bonding process in vacuum with self contain dry pumping system
• VIS, IR and NIR optics for backside alignment


 

 

In Situ Plasma Activation Treatment

In Situ Aligned Systems

 

 

Aligned Wafer Bonders

Model: FAB12
Wafer Size: 150mm & 200mm (or 300mm)
Wafer Thickness: Max. stack height 6.5mm
Wafer Transmission: Contact edge 3mm area
Air Pressure: 10-6mbar range
Pumpdown Time: 5 min (to 10-5mbar)
Max Bonding Force: 25kN
Case Amount: 2 or 3 (FOUP, SMIF or Open Cassette
                          Load Ports)