Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.

Wafer Fabrication

Kayaku Advanced Materials develops, manufactures, sells, and supports specialty niche chemicals for semiconductor/IC, thin film head, and other electronic manufacturing applications. The primary focus is photosensitive materials, such as photoresists, and other ancillary products. Kayaku Advanced Materials consists of proprietary and non-proprietary products requiring state-of-the-art technical expertise, high reproducibility, high product cleanliness, and specialty microfiltration.


Kayaku Advanced Materials manufactures all of their products in their newly re-fitted 25,000 square foot facility in Newton, Massachusetts. All the products are made in environmentally controlled areas and packaged in Class 100 Cleanroom environments.


Kayaku Advanced Materials resist products are available in 500ml, 1 Liter, 4 Liter Amber glass bottles, in addition we can package into 10 and 20 Liter Nowpaks. The ancillary products are available in 4 Liter Polyethylene bottles, Nowpaks and 55 Gallon drums.





Product index: Application Note (pdf)






SU-8 2000 & 3000 Series Resists


The SU-8 product line consists of chemically amplified; epoxy based negative resists with high functionality, high optical transparency and are sensitive to near UV radiation. Cured films or topography are highly resistant to solvents, acids and bases and have excellent thermal stability, making it well suited for permanent use applications.


SU-8 2000 Permanent Epoxy Resists

SU-8 2000 chemically amplified, i-line resists are well-suited for the fabrication of permanent device structures. These negative tone, epoxy based resists exhibit excellent chemical resistance and low Young's Modulus which makes them ideal for fabricating micro/nano structures such as cantilevers, membranes, and microchannels.


Material uses:
  • Fabrication of PDMS molds
  • Structural components such as micro arrays, fluidic channels, display pixel walls and dielectric layers
  • Dry etch masks
  • Rapid prototyping
Material attributes:
  • Spin coat films from 75µm
  • High thermal and chemical resistance
  • Optically transparent
  • Compatible with i-line imaging equipment



25 µm wide, 125 µm high
Source: MicroChem
10µm features, 50µm SU-8 2000 coating
Source: Micro Resist Technology


Genoletet, al., IBM-Zurich, Rev. Sci.
Instrum., 70, 2398 (1999)

Microfluidic Actuator

N Chronis, LP Lee, UC Berkeley, μTAS 2002, 754 (20

Passivation layer for diodes.

Encapsulation with imaged vias.

LED Passivation Application


SU-8 3000

SU-8 3000 has been formulated for improved adhesion and reduced coating stress. It is being used where high bond strength and improved flexibility for microstructure fabrication is desired. As a result, adhesion to the substrate is greatly improved.
Material uses:
  • Waveguides

  • Microfluidics

  • Stamps

Material attributes:

  • Improved adhesion
  • Reduced coating stress
  • Vertical sidewalls
  • Greater than 100 μm film thickness in a single coat
  • Excellent dry etch resistance

10µm features in 50µm SU-8 3000 (contact expose)
Source: MicroChem





KMPR 1000 Photoresist

KMPR® 1000 i-line photoresist is a high contrast, epoxy based photoresist that can be developed in a conventional aqueous alkaline developer (TMAH) and stripped from the substrate using Remover PG or plasma. KMPR is designed to coat 4-110 µm in a single step using four standard viscosities.


Lithography can be used to form KMPR molds that have the required dimensional accuracy and sidewall verticality for micro electroforming.


Deep reactive ion etching (DRIE), KMPR will survive dry etch for the extended periods of time necessary to perform >20 µm deep etching with HAR.

Material uses:

  • MEMS
  • DRIE
  • Electroplating
  • Permanent Structures

Material attributes:

  • High aspect ratio with vertical sidewalls
  • High chemical and plasma resistance
  • Greater than 100 µm film thickness in a single coat
  • Excellent adhesion to metals
  • Excellent dry etch resistance
Plating Permanent Deep Etch

Plating (100 µM tall Ni posts, KMPR removed)

Electroformed Ni gear after stripping KMPR
Source: Univ. of Birmingham


PMGI & LOR Under Layer Resists

PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from data storage and power devices, to BAW filters. Used beneath photoresists in a bi-layer stack, PMGI and LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach. This includes very high resolution metallization (0.25 microns) to thick (4µm) metallization. These unique materials are available in a variety of formularies to meet virtually any customer need.

Material uses:

  • Metal lift-off processing

  • Airbridge fabrication

  • Release layers

Material attributes:

  • Won’t intermix when over-coated with imaging resists

  • Single step development of bi-layer stack in TMAH, or KOH developers

  • High thermal stability: TG ~190 C

  • Removes quickly and cleanly in conventional resist strippers

  • Enables sub .250µm micron bi-layer resist imaging

  • Enables high yield, very thick (>3µm) metal lift-off processing


LOR Bi-layer Lift-off Resists

  • High aspect ratio with vertical sidewallsresolution, for feature size <0.25µm metallization lift-off
  • Undercut controllable
  • Good adhesion on Si, NiFe, GaAs, InP and III-V compounds etc.
  • High thermal stability
  • Remove easily and high lift off yield


Bi-Layer Lift-Off Process Lift-Off: An enabling, additive lithographic process.



GaAs Modulator with Al airbridge
Source: Nortel

PMGI used as a sacrificial layer on which the airbridge was built. The PMGI layer was subsequently removed with conventional resist removal processing.




PMMA Resist


PMMA positive resists are based on special grades of polymethyl methacrylate designed to provide high contrast, high resolution for e-beam and X-ray lithographic processes. In addition, PMMA is often used as a protective layer in III-V device wafer thinning applications. Standard products include 495,000 and 950,000 molecular weights (MW) in a wide range of film thicknesses formulated in chlorobenzene, or the safer solvent anisole. In addition 50,000, 100,000, and 200,000 are available upon request.


Copolymer resists are based on a mixture of PMMA and ~8.5% methacrylic acid. Copolymer MMA (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off resist processes where independent control of CD size and shape of each resist layer is required. Standard copolymer resists are formulated in the safer solvent ethyl lactate and are available in a wide range of film thicknesses.

Applications for PMMA & copolymer resists (MMA (8.5)MAA)

T-gate resulting from PMMA/Copolymer bilayer resist stack.


Product Attributes

  • Feature size : less than 0.1µm imaging
  • E-beam and X-ray exposure
  • Molecular Weights (MW) : 495K, 950K, custom MW available

  • Solids content 2% - 11%, customized available
  • Molecular Solvent : Chlorobenzene (C) or Anisole (A)
  • Applications : E-beam usage, wafers, thinning, T-gate, etc.

PMMA & Copolymer Resists:



Top Layer Construction Combined Layer Construction



PriElex® Jettable Polymeric Materials

PriElex® is envisioned as a new suite of functional inks for inkjet printing of electronic devices. PriElex® polymeric inks are designed and optimized for jetting and are suitable for maskless lithography, rapid prototyping, and clean, non-contact printing. Material formulations are tailored for critical inkjet properties such as viscosity, evaporation rate, and surface tension, and exhibit improved latency, firing stability, and resolution over standard resist formulations.

MicroChem currently offers XP PriElex® SU-8 1.0, an inkjettable SU-8 ink, adding to the developer's toolbox of printable materials available for the fabrication of single or multi-layer structures. Ink development was performed around the FUJIFILM Dimatix DMP printer, one of the most common R&D and prototyping inkjet tools.

Other PriElex® functional inks are envisioned, with some currently under development.


PriElex® SU-8 Material Uses:
  • Permanent 3D structures without photolithography
  • Coating over topography and irregular substrates
  • Dielectric and isolation patterning
  • Etch masking and other applications
  PriElex® SU-8 Material Attributes:
  • Low temperature cure (<150° C)
  • Optically transparent
  • Excellent thermal stability
  • High chemical resistance
  • Low Young's Modulus
  • Reduced material waste

Continuous Printed Patterns

PriElex® SU-8 Direct Write: 5 passes, linear scan
Source: MicroChem Corp


Additive Via Fabrication

Via pattern created with additive inkjet process
Source: MicroChem Corp



SU-8 3000CF DFR - Dry Film Resists

SU-8 3000CF DFR is a photosensitive permaent negoative ton dry fill resist.



PriElex® SU-8 Material Uses:
  • Permanent 3D structures without photolithography
  • Coating over topography and irregular substrates
  • Dielectric and isolation patterning